Intel ‘Meteor Lake’ 14th Gen Core: Intel 4, TSMC 3nm, 4nm, and 5nm technology

0
1
Intel 'Meteor Lake' 14th Gen Core: Intel 4, TSMC 3nm, 4nm, and 5nm technology

The upcoming Intel 14th Generation Core “Meteor Lake” CPU will have a quad-tile design, indicating that the GPU tile will be in the centre of the chip. On the top, there will be a CPU compute tile, and on the bottom, there should be a SoC tile.

Intel has reportedly trial-produced computing chips in Meteor Lake processors at its Fab 42 facility in Arizona, USA but the final processors will use a jointly-built design with the help of TSMC. Intel will use its Intel 7 process for the 13th Gen Core “Raptor Lake” CPUs while the Intel 4 process will be used for the 14th Gen Core “Meteor Lake” CPUs.

“According to industry news and foreign media reports, the Intel Meteor Lake processor adopts a new chip design that integrates computing chips, graphics chips, and connection chips (SoC-LP tiles) into one through Intel Foveros advanced packaging technology. The news pointed out that Intel has trial-produced computing chips in Meteor Lake processors at Fab 42 in Arizona, USA, and will release chip foundry orders to jointly build the strongest processors with TSMC”.

The new Meteor Lake CPUs will be using a computing chip on Intel 4, which will include a Redwood Cove performance core (P-core) and Cresmont efficiency core (E-core). The GPU tile on the Meteor Lake CPUs will be made by TSMC on their 3nm node, while the SoC-LP tile will also be made by TSMC.

Story Highlights

  • Intel is just putting its new 12th Gen Core “Alder Lake” CPUs onto shelves and into gamers’ hands, with the 13th Gen Core “Raptor Lake” coming out in 2022, and the next-next-gen 14th Gen Core “Meteor Lake” CPU gaining some new details from recent reports.

  • Intel will reportedly be using its in-house Intel 4 process which is launching in 2023, with Meteor Lake using a chip block design with some (but not all) of the chip blocks being built by TSMC. The new Intel 14th Gen Core “Meteor Lake” CPUs will integrate computing chips, graphics chips, and connection chips (SoC-LP tiles) into a single Intel Foveros advanced packaging technology.